Low Temperature Co-fired Ceramics (LTCC)

Description

LTCC is a multi-layer substrate technology for advanced electronics and microsystem applications. The LTCC Boutique Foundry offers a one-stop foundry solution from concept design to assembly, hybrid integration, reliability testing and prototyping.

Key differentiated services offered are:

  • Proof of concept
  • Assembly and packaging
  • Reliability testing
  • High-mix production
  • Fast turn-around time of less than 4 weeks for standard design rules
  • Bridging technology gap from design to manufacturing

Novelty

  1. The LTCC Foundry provides one-stop solution in advanced substrate design and manufacturing with core competencies in substrate design, process development, prototyping and performance validation.
  2. Low shrinkage dimensional tolerance.
  3. 50mm line / space
  4. Double-sided cavities
  5. Composite dielectric integration

Advantages & Benefits

  1. Integration of passives and active devices
  2. Reduced component count
  3. Reduced weight and size
  4. Hermetic sealing 
  5. 3-D interconnection
  6. Composite material fabrication
  7. High frequency RF performance
  8. High reliability
  9. Low loss dielectric / good dielectric properties control
  10. Good compatibility with wide bandgap semiconductor devices
  11. Excellent heat transfer properties
  12. Integrated antennas 
  13. Low electronic noise

Market & Applications

LTCC provides an excellent platform for multi-functional and high-density integration of semiconductors, circuits, passives and antennas. Key applications include:

  • High-speed digital electronics 
  • Wireless communications
  • Automotive electronics
  • Medical and biomedical devices
  • Harsh environment sensors
  • Solid-state lighting
  • Avionics and aerospace devices

Media Coverages

  • 07 Jan 08   The Business Times

    Singapore start-up develops unique LED lighting solution   


  • 26 Jul 07    The Business Times

    US$2.7b in venture capital funds raised to invest in Asia    

Accolades

  • 23 Mar 07   Best Paper Prize in the IEEE International Workshop on Antenna Technology 2007 (iWAT07)

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