LTCC is a multi-layer substrate technology for advanced electronics and microsystem applications. It provides an excellent platform for multi-functional and high-density integration of semiconductors, circuits, passives and antennas
Hundreds of discrete electronic components have been shrunk into a single IC chip. Reducing the system down to silicon can cause a paradigm shift within the market. The inexpensive chip set solutions will open up high-volume markets for deeply embedding UHF RFID capability into mobile and portable consumer applications not yet considered possible.